US PATENT SUBCLASS 156 / 101
.~.~.~ With cutting or breaking or partial removal of interlayer and/or lamina

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
99  DF  .~.~ Optically transparent glass sandwich making (e.g., window or filter) {8}
101.~.~.~ With cutting or breaking or partial removal of interlayer and/or lamina

DEFINITION

Classification: 156/101

(under subclass 99) Processes combined with the step of (1) cutting the glass lamina and/or interlayer; (2) applying stress and/or strain to a glass lamina and/or interlayer to cause its separation thereof into parts; or (3) separating a portion of the interlayer from between the glass lamina.

(1) Note. The expression "cutting" in the definition of this subclass has the same meaning as defined in the class definition of Class 83.

SEE OR SEARCH THIS CLASS, SUBCLASS:

247+, for processes of stripping an adhered lamina. The lamina for the purposes of subclasses 247+ may be a coating or a preform.

250+, for processes of cutting without regard to the composition of the lamina.

SEE OR SEARCH CLASS 65, Glass Manufacturing,

56, for a process of bonding glass to a formed part by a glassworking operation combined with a step of cutting, perforating or breaking.

83, Cutting,

13+, and 861 for processes of cutting not provided for elsewhere; see the search notes.