US PATENT SUBCLASS 156 / 220
.~.~.~.~ Subsequent to lamination

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
196  DF  .~.~ With permanent bending or reshaping or surface deformation of self sustaining lamina {11}
219  DF  .~.~.~ Surface deformation only of sandwich or lamina (e.g., embossed panels) {1}
220.~.~.~.~ Subsequent to lamination

DEFINITION

Classification: 156/220

(under subclass 219) Processes in which the step of deforming the surface only occurs after the parts have been brought into assembled relationship.

(1) Note. Embossing of an assembly of laminae in which the adhesive may not be completely cured are included herein.