US PATENT SUBCLASS 156 / 268
.~.~.~ Partial cutting bonded sandwich (e.g., grooving or incising)

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
250  DF  .~.~ With cutting, punching, tearing or severing {8}
268.~.~.~ Partial cutting bonded sandwich (e.g., grooving or incising)

DEFINITION

Classification: 156/268

(under subclass 250) Processes combined with the step of (1) partially cutting, incising or grooving through a portion of the thickness of one lamina of a sandwich or (2) cutting through the entire thickness of only one of the laminae of a sandwich, the cutting occurring within the adhered area of the sandwich.

(1) Note. Processes directed to scoring, grooving or incising of the laminated material are found in this subclass.

SEE OR SEARCH THIS CLASS, SUBCLASS:

257, for the partial cutting of laminae prior to

association.

270, for processes of cutting one web only in which the cutting is subsequent to lamination and the cutting occurs other than within the confines of both laminae.

SEE OR SEARCH CLASS 83, Cutting,

861+, for processes and means of cutting other than completely through the work.