US PATENT SUBCLASS 174 / 259
.~.~.~ Adhesive/bonding

Current as of: June, 1999
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174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

68.1  DF  CONDUITS, CABLES OR CONDUCTORS {15}
250  DF  .~ Preformed panel circuit arrangement (e.g., printed circuit) {9}
256  DF  .~.~ With particular material {3}
259.~.~.~ Adhesive/bonding

DEFINITION

Classification: 174/259

Adhesive/bonding:

(under subclass 256) Subject matter including a material which causes parts of the structure to stick, bind or fasten together.

SEE OR SEARCH THIS CLASS, SUBCLASS:

263, for soldered feed through connections where the composition of the solder is nominal.

SEE OR SEARCH CLASS

156, Adhesive Bonding and Miscellaneous Chemical Manufacture, appropriate subclasses for adhesive methods and materials, per se.