US PATENT SUBCLASS 174 / 263
.~.~.~.~ With solder

Current as of: June, 1999
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174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

68.1  DF  CONDUITS, CABLES OR CONDUCTORS {15}
250  DF  .~ Preformed panel circuit arrangement (e.g., printed circuit) {9}
261  DF  .~.~ With particular conductive connection (e.g., crossover) {2}
262  DF  .~.~.~ Feedthrough {3}
263.~.~.~.~ With solder

DEFINITION

Classification: 174/263

With solder:

(under subclass 262) Subject matter wherein the conductive material is a readily meltable metal or alloy that produces a bond at a junction of two metal surfaces.

SEE OR SEARCH THIS CLASS, SUBCLASS:

259, for bonding with solder in printed circuits where the solder has a significant composition.

SEE OR SEARCH CLASS

228, Metal Fusion Bonding, appropriate subclasses for soldering methods and devices, per se.