US PATENT SUBCLASS 200 / 198
.~.~.~ Contact dips (moves relative to container) into the conductive liquid

Current as of: June, 1999
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200 /   HD   ELECTRICITY: CIRCUIT MAKERS AND BREAKERS

182  DF  LIQUID CONTACT {17}
195  DF  .~ Spray or jet by centrifugal force and/or by other pressure-producing means {1}
196  DF  .~.~ Periodic {2}
198.~.~.~ Contact dips (moves relative to container) into the conductive liquid

DEFINITION

Classification: 200/198

(under subclass 196) Subject matter wherein the contacts move relative to the container of the conductive liquid and dip into the liquid spray or jet.