US PATENT SUBCLASS 204 / 192.11
.~.~ Ion beam sputter deposition

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.11.~.~ Ion beam sputter deposition

DEFINITION

Classification: 204/192.11

Ion beam sputter deposition:

(under subclass 192.1) Processes for the deposition of target material onto a surface (or substrate), to coat or form, wherein a beam of ions generated by an ions source remote from the target is employed to sputter material from the target.