| 205 / | HD | ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS |
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| 80 |  | ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42} |
| 81 | DF | .~> Involving measuring, analyzing, or testing {1} |
| 85 | DF | .~> Displacement or replacement coating |
| 86 | DF | .~> Employing internal battery action during coating |
| 87 | DF | .~> Simultaneous deplating and plating |
| 88 | DF | .~> Utilizing subatmospheric or superatmospheric pressure during coating |
| 89 | DF | .~> Utilizing magnet or magnetic field during coating {1} |
| 91 | DF | .~> Utilizing electromagnetic wave energy during coating (e.g., visible light, etc.) {1} |
| 93 | DF | .~> Contacting coating as it forms with solid member or material other than electrode |
| 94 | DF | .~> Utilizing mist prevention |
| 95 | DF | .~> Coating has specified thickness variation |
| 96 | DF | .~> Controlling current distribution within bath {1} |
| 98 | DF | .~> Treating process fluid by means other than agitation or heating or cooling {3} |
| 102 | DF | .~> Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure DC {2} |
| 105 | DF | .~> Depositing predominantly single metal or alloy coating on nonmetal using specified waveform other than pure DC or 60 Hz sine wave AC (e.g., single metal or alloy coating within or above pores of anodic oxide layer, etc.) |
| 106 | DF | .~> Forming nonmetal coating using specified waveform other than pure DC or 60 Hz sine wave AC (e.g., anodic oxide coating, etc.) {2} |
| 109 | DF | .~> Coating contains embedded solid material (e.g., particles, etc.) {1} |
| 111 | DF | .~> Coating is dendritic or nodular |
| 112 | DF | .~> Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.) {1} |
| 114 | DF | .~> Uniting two separate solid materials |
| 115 | DF | .~> Repairing |
| 116 | DF | .~> Mirror or reflector produced |
| 117 | DF | .~> Utilizing brush or absorbent applicator |
| 118 | DF | .~> Coating selected area {10} |
| 137 | DF | .~> Coating moving substrate {5} |
| 147 | DF | .~> Applying current to substrate without mechanical contact (e.g., liquid contact, bipolar electrode, etc.) |
| 148 | DF | .~> Agitating or moving electrolyte during coating |
| 149 | DF | .~> Coating predominantly single metal or alloy substrate of specified shape {3} |
| 157 | DF | .~> Coating predominantly semiconductor substrate (e.g., silicon, compound semiconductor, etc.) |
| 158 | DF | .~> Coating a substrate predominantly comprised of nonconductive material to which conductive material or material which can be converted into conductive material has been added (e.g., nonconductive polymer substrate containing carbon or copper oxide particles, etc.) |
| 159 | DF | .~> Coating predominantly nonmetal substrate {4} |
| 170 | DF | .~> Forming multiple superposed electrolytic coatings {6} |
| 183 | DF | .~> Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating {1} |
| 188 | DF | .~> Forming nonelectrolytic coating before forming nonmetal electrolytic coating {2} |
| 191 | DF | .~> Forming nonelectrolytic coating after depositing predominantly single metal or alloy electrolytic coating {3} |
| 198 | DF | .~> Forming nonelectrolytic coating after forming nonmetal electrolytic coating {1} |
| 205 | DF | .~> Treating substrate prior to coating {3} |
| 220 | DF | .~> Treating electrolytic or nonelectrolytic coating after it is formed {5} |
| 230 | DF | .~> Utilizing fused bath {3} |
| 234 | DF | .~> Utilizing nonaqueous bath {3} |
| 238 | DF | .~> Depositing predominantly alloy coating {6} |
| 261 | DF | .~> Depositing predominantly single metal coating {14} |
| 316 | DF | .~> Forming nonmetal coating {8} |