US PATENT CLASS 216
Class Notes


Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES



DEFINITION

Classification: 216/

Class 216 is an integral part of Class 156. It incorporates all the definitions, rules, and hierarchy pertaining to subject matter of Class 156.

GENERAL STATEMENT OF CLASS 216 SUBJECT MATTER:

This is the Generic class for chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

(1) Note. The chemical etching required for placement in this class is any intentional change of shape of an article or substrate by the removal of material involving a chemical reaction or physical solvation using a chemical agent (the etchant). This is the residual class for removing a surface by chemical reaction or solvent action regardless of the substrate acted on. Bright Polishing of a metal with acid solution is considered etching and appropriate for this class. The processes of the patents in this class often include the formation of a design, but the production of a design is not required to place the patents here.

(2) Note. Reduction in size using a chemical etchant of an

unmasked article, substrate or unmasked geometric figure, e.g., sphere, etc. is proper for this class.

(3) Note. Etching of a masked article, to direct the etchant to only a portion of the article or substrate is proper for this class.

(4) Note. This class is not intended for the total dissolving of an article or substrate. Furthermore, the remaining article or substrate must be the desired product and not the removed material. An example of a process not proper for Class 216 would be ore beneficiating where the dissolved material is what is desired and useful and not the remaining residue material. Additionally a process of dissolving out impurities or unwanted material to leave a desired article is proper for this class when said process is not provided for elsewhere.

(5) Note. Chemical milling is considered within the scope of the term etching. (6) Note. Class 216 provides only for etching processes. Etching compositions are elsewhere. See Lines With Other Classes, below.

LINES WITH OTHER CLASSES

Class 216 is an integral part of Class 156. It incorporates all the definitions, rules, and hierarchy pertaining to subject matter of Class 156.

Etching compositions are in Class 252, subclasses 79.1+ (see the class line below in regards to Class 252 and nominal etching processes) and etching apparatus is classifiable in Class 156, subclass 345. Compounds disclosed as useful in etching are classified in the respective compound classes and articles which are produced as the result of an etching process are classified in the appropriate article class or stock material class.

A. SPECIAL CLASS LINES

1. CLASS 29, METAL WORKING

Class 216 has several important relationships with this Class 29. Both classes take designated single-step processes, and both are locations for multistep processes for manufacturing designated products or using certain combinations of steps.

Single-step processes to produce a Class 29 special product, include shaping particulate metal by pressure alone. In addition Class 29 provides, for example, for processes of burnishing, filing, or the mechanical joining of parts to manufacture the special article. Where only an etching step is claimed, the process is assigned to Class 216, even though a product designated for Class 29 is manufactured.

Multistep processes for Class 29 are of two types: (a) Those for making specified articles, enumerated in that part of Class 29 schedule which precedes subclass 400.1.; (b) Multistep manufacturing processes not provided for elsewhere.

Insofar as processes of type (a) are concerned, these are assigned to Class 29, even when an etching step is claimed as part of the multistep process, except for processes classifiable in subclasses 825+, which follows the category (b) rule given in the next paragraph.

Processes of type (b) are provided for in Class 216 when they claim: (1) Etching combined with the shaping of a nonmetal; (2) Etching either nominal or specific combined with broad or nominally claimed metal shaping steps; (3) Specific etching including steps for assembling parts that have been etched or are to be etched; Processes of type (b) are classified in Class 29 when they claim: (1) Nominal etching combined with specific metal shaping steps; (2) Nominal etching combined with mechanical joining, either broad or specific.

2. CLASS 438 SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS.

Classification is proper for Class 438:

(1) When the specification contains only disclosure of semiconductive material, precursor, substrate, or device and the claims are generic in nature the classification is proper for Class 438.

(2). When the specification contains disclosure to species of semiconductive material, precursor, substrate, or device and nonsemiconductive species and the claims are directed to the semiconductive material species only classification is proper for Class 438.

(3) When the specification contains disclosure to species of semiconductive material, precursor, substrate, or device only and the claims are directed to semiconductive material species only classification is proper for Class 438.

Classification is proper for Class 216:

(1) When the specification contains disclosure to species of semiconductive material, precursor, substrate, or device and nonsemiconductive species and the claims are generic in nature the classification is proper for Class 216 Etching.

(2) When the specification contains disclosure to species of semiconductive material, precursor, substrate, or device and nonsemiconductive species and the claims contain semiconductive species and nonsemiconductive species classification is proper for Class 216 Etching.

(3) When the specification contains disclosure to semiconductive material used in a nonelectrical function and the claims contain semiconductive material used in nonelectrical function classification is proper for Class 216 Etching.

B. GENERAL LINE WITH OTHER CLASSES 1. CLASS 134 CLEANING AND LIQUID CONTACT WITH SOLIDS

Class 134 is noted for cleaning processes wherein a surface is treated to remove or separate unwanted adherent material, e.g., dirt, scale, coatings, etc. Class 134, subclasses 1.1 through 1.3 provide for processes of cleaning using a plasma and for cleaning of semiconductive material. Subclasses 2 and 3 are noted for chemical bleaching, oxidation, or reduction of a metallic siliceous or calcareous base.

2. CLASS 204 CHEMISTRY: ELECTRICAL AND WAVE ENERGY and CLASS 205 ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN AND METHODS OF PREPARING THE COMPOSITIONS

Chemical etching performed on a composition, product, or article made by a Class 204 process (e.g., an entire article previously etched by electrolysis, a product portion modified by electrolytic material treatment, etc.) is considered to provide a significant modification of the composition, product, or article made by the Class 204 process, therefore placing the combination of a Class 204 process followed by Class 216 chemical etching in Class 216. However, the combination of a Class 205 electrolytic coating step followed by Class 216 chemical etching performed (1) to allow at least a portion of the electrolytic coating to remain and (2) to only significantly modify the electrolytic coating, per se, is considered to be an electrolytic coating process followed by a mere perfecting step for the electrolytic coating, therefore placing the combination in Class 205. The significant modification of only the electrolytic coating allows for mere incidental alterations to other portions of a coated article such as the substrate provided that such changes are clearly unintentional (e.g., chemical etching through an electrolytic coating which may also progress into the substrate in some areas to allow complete penetration through all desired other areas of the electrolytic coating, etc.). Class 216 also provides for the original classification when the claims are alternative (claims to a Class 216 process and claims to a Class 205 electrolytic etching, or when a generic claim is present and no species is specifically claimed). When, however, a generic claim is present (disclosure includes both Class 216 and Class 204 or Class 205 subject matter) and a Class 204 or Class 205 species is specifically claimed, and there is no specific claim to a Class 216 etching process, the original classification is in Class 204 or Class 205 and a mandatory cross-reference is placed into Class 216 based on the generic claim.

Other combinations of Class 204 step(s) with Class 216 step(s) will follow the general class line for the combination of Class 204 step(s) with those from other classes as stated at the beginning of Class 204. In particular, see Class 205, subclasses 123+, for electrolytic coating of or with semiconductor material, subclasses 125+ for electrolytic coating to produce a circuit board or a printed circuit, subclasses 206+ for contacting a substrate with a solid member or material (e.g., polishing, rolling, etc.) combined with a subsequent step of electrolytic coating, subclasses 210+ for treating a substrate with a liquid other than tap water (e.g., chemical etching, etc.) combined with a subsequent step of electrolytic coating, subclasses 640+ for electrolytic erosion of a workpiece to change the shape or surface configuration thereof, and subclasses 687+ for electrolytic material treatment, in general (e.g., electrolytic stripping of an entire coated layer from a substrate, etc.).

3. CLASS 219 ELECTRIC HEATING

See Class 219, subclasses 121.36+ for removing or altering material by the use of a high temperature thermal plasma. Class 216 provides for the use of a cold plasma which is a chemical etching process involving reactive ions and a substrate whereas the high temperature thermal plasma proper for Class 219 alters the substrate solely by thermal means. Class 219 subclasses 68+ provide for processes of cutting or disintegrating metal by metal heating, subclasses 121.19+ for processes of using an electron beam or etching or trimming metal, subclasses 121.36+ for processes of using a high temperature thermal plasma to etch metal, and subclasses 121.6+ for processes of using a laser to etch metal.

4. CLASS 264 PLASTIC AND NONMETALLIC ARTICLE SHAPING OR TREATING: PROCESSES

Combinations of shaping a plastic material and etching the shaped product, or combinations of shaping, laminating, and etching are proper for Class 216. Laser ablation of a Class 264 material in the absence of an added reactive chemical is proper for Class 264, however, when a reactive chemical is used in the laser ablation process the process is classifiable in Class 216. Subclasses 22+ for the shaping of an article by removing a portion by electrical or wave energy, e.g., laser ablation wherein no chemical etchant is employed, etc., subclass 49 for forming pores in situ by treating an occluded solid, subclasses 82+ for reactive gas or vapor treatment of an article, subclasses 211.12+ for processing or treating after extruding, subclasses 219+ for processes of preparing a mold which includes an etching step in the mold manufacture followed by a shaping operation, and subclass 341 for the solvent polishing of a shaped or solid article.

5. CLASS 427 COATING PROCESSES Subclasses 307+ for processes limited to etching for making a base more compatible with or adherent to the coating wherein the base is the substrate (work) onto which a coating is to applied.

6. CLASS 430 RADIATION IMAGERY CHEMISTRY: PROCESS, COMPOSITION, OR PRODUCT THEREOF

For processes of radiation imagery including claimed exposing and finishing by a post imaging process, e.g., developing, etching, etc. or finishing an image, e.g., developing, etching, etc. where the claim is silent as to an exposure step.

Subclass 5 for producing a radiation mask, subclasses 313+ for a post imaging process of treating a resist to remove a portion of the same.

REFERENCES TO OTHER CLASSES

SEE OR SEARCH CLASS

8, Bleaching and Dying; Fluid Treatment and Chemical Modification of Textiles and Fibers, appropriate subclasses for chemical methods of dyeing fabric and the like and/or forming an ornamental effect by the chemical modification of a fiber or fabric.

28, Textiles: Manufacturing, is the generic class for textile operations, especially

167+, 178+, 261, and 265+ for significantly claimed textile operations combined with steps of coating, dyeing, fluid treatment.

51, Abrasive Tool Making Process, Material, or Composition,

293+, for processes of making an abrading tool.

65, Glass Manufacturing, 31, for etching or leaching a glass preform, and subclass 61 for the wearing away, abrading, or grinding of surface material.

75, Specialized Metallurgical Processes, Compositions For Use Therein, Consolidated Metal Powder Compositions, and Loose Particulate Mixtures,

715+, for the etching of a metal to recover it from another metal.

101, Printing,

463.1, for processes of making a printing plate.

112, Sewing,

403, for a sewn web or sheet including a decomposable thread or component.

144, Woodworking,

358, for embossing or imprinting of wood.

148, Metal Treatment, for treating of metal to modify or maintain the internal physical structure (microstructure) or chemical properties of the metal. Heating and working is most often used to effect these changes.

166, Wells, 307, for methods of treating a geologic formation in a well bore which may include an etching step.

252, Compositions,

79.1+, provides for patents which in addition to an etching composition claim also contain a claim to a nominal process of etching even though the composition of the material treated is recited. Any detail in the treating step, e.g., dipping, spraying, etc., is sufficient to render the process more than nominal and proper for Class 216. Class 216 is proper for a nominal etching process when the etching composition is not claimed. Subclasses 80+ for descaling agents and 89.1+, appropriate subclasses, for detergents containing acid or alkaline agents which may etch the substances treated and for mere methods of use when the composition is claimed.

356, Optics: Measuring and Testing,

31, for methods of determining the orientation of the cystallos:graphic axis of a crystal which includes etching a surface and then optically observing the etched surface.

419, Powder Metallurgy Processes, for etching combined with a metal powder consolidation step,

5+, for etching or dissolving of a preformed component, e.g., core, etc. to form a hollow metal article.

423, Chemistry of Inorganic Compounds,

1+, for processes of treating a mixture to obtain an inorganic compound or free elemental nonmetal which may involve a leaching or dissolving step. Also this class generally provides for processes involving a chemical reaction.

521, Synthetic Resins or Natural Rubbers,

61+, for forming a cellular product without expanding of the matrix. 588, Hazardous or Toxic Waste Destruction or Containment, appropriate subclasses for the destruction or containment of hazardous or toxic etching waste.

GLOSSARY:

Terms used throughout the schedule and definitions are to have the meaning ascribed below.

Generally accepted or commonly used art terms retain their meaning found in their everyday usage and are not found in this glossary. Certain specialized terms are employed in these subclasses and they have been given definitions altered to meet the needs of this class. Some or all of the terms may be broader or more restricted as well as different in meaning compared to normal usage.

ACID

A chemical compound which yields hydrogen ions when dissolved in water, whose hydrogen can be replaced by metals or basic radicals, or which reacts with bases to form salts and water (neutralization).

GAS

Matter of very low density and viscosity, and relatively great expansion and contraction with changes in pressure and temperature, that is readily diffusive, with a tendency to expand indefinitely, with molecules or atoms in free movement. The term gas includes vapor.

GLASS

Must have all of the attributes described in 1-5 below:

(1) An inorganic product the constituents of which generally include a glass former (e.g., As2O3, B2O3, GeO2, P2O5, SiO2, V2O5) which has an essential characteristic of creating or maintaining, singularly, or in a mixture that type of structural disorder characteristic of a glassy condition, other oxides which approach glass forming properties (e.g., Al2O3, BeO, PbO, Sb2O3, TiO2, ZnO, and ZrO2), as well as oxides that are practically devoid of glass forming tendencies (e.g. BaO, CaO, K2O, Li2O, MgO, Na2O, and SrO). Pure and modified silica, silicon, and slag are also included.

(2) Formed by fusion and cooled to a rigid condition generally without crystallization. (3) Having no definite melting point, whereby the mass has the characteristic of passing through a plastic state before reaching a liquid state when heated.

(4) Incapable in the solid state of permanent deformation.

(5) Fractures when subject to deformation tension.

INORGANIC

Pertaining to compounds that do not generally contain carbon and to elements in their free form. It relates to any of the compounds not encompassed under the term Organic defined below in this Glossary.

METAL

As found in the Sargent - Welsh Periodic table (copyright date 1979) of the elements, is any element not named in the following listing, all group VIII, VIIB, VIB elements except polonium, nitrogen, phosphorus, carbon, silicon, and boron.

ORGANIC

Is a compound containing carbon, which is further characterized by the presence in the molecule of two carbon atoms bonded together; or one atom of carbon bonded to at least one atom of hydrogen or halogen; or one atom of carbon bonded to at least one atom of nitrogen by a single or double bond. The following compounds are specifically excluded as being Organic for classification purposes, to-wit: hydrocyanic acid, cyanogen, isocyanic acid, cyanamide, cyanogen halides, isothiocyanic acid, fulminic acid, and metal carbides.

PLASMA

A gas that is sufficiently ionized for its properties to depend on the ionization. It contains approximately equal numbers of positive ions and electrons, so the mixture is electrically neutral, highly conductive, and affected by magnetic fields. A thermal plasma is produced by temperatures above 20,000 degrees centigrade. RADIATION

The propagation of energy through space or through a material. It may be in the form of electromagnetic waves, corpuscular emissions or sound waves. The format is usually categorized according to frequency, e.g., Hertzian, infrared, visible light, ultraviolet, X-ray, gamma ray, etc. Corpuscular emissions are categorized as alpha, beta, or cosmic rays.

SUBSTRATE

The entire article or workpiece contacted by the chemical reagent, except for materials which have been applied to an article or workpiece for the sole expressed purpose of protecting at least a portion thereof from the action of the chemical material, i.e., a resist.