US PATENT SUBCLASS 216 / 33
ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.)

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

33ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) {2}
34  DF  .~> Etching improves or promotes adherence of preforms being bonded {1}
36  DF  .~> Removing at least one of the self-sustaining preforms or a portion thereof

DEFINITION

Classification: 216/33

ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.):

(under the class definition) Process s including the step of adhesively or autogenously bonding two or more self sustaining preforms.

(1) Note. A preformed etching mask or resist is not considered as being a preform proper for this subclass if it is ultimately to be removed. See subclasses 41+ for etching processes involving a preformed etch mask or resist.

(2) Note. Processes appropriate for this subclass require the forming of intended composite materials having two or

more layers and wherein the final intended material is a composite having two or more layers. A multilayered substrate as a preform without the claimed forming of the multilayers by adhesive or autogenous bonding is not appropriate herein unless a self-sustaining preform is bonded thereto and remains with the multilayered substrate. Removing the self-sustaining preform (etch mask or resist) after the etching process results in a product which does not meet the required parameters for this subclass.

SEE OR SEARCH CLASS

29, Metal Working, for mechanical assembly combined with etching of special articles.

156, Adhesive Bonding and Miscellaneous Chemical Manufacture, for adhesive bonding or laminating without etching.