US PATENT SUBCLASS 216 / 43
.~ Adhesively bonding resist to substrate

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

41  DF  MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST) {9}
43.~ Adhesively bonding resist to substrate

DEFINITION

Classification: 216/43

Adhesively bonding resist to substrate:

(under subclass 41) Process wherein the masking is applied by adhesively bonding a self-sustaining patterned resist to a substrate.

SEE OR SEARCH CLASS

156, Adhesive Bonding and Miscellaneous Chemical Manufacture, for production of bonded materials.