US PATENT SUBCLASS 228 / 195
.~.~ With incipient melting of bonding surface


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
193  DF  .~ Diffusion type {2}
195.~.~ With incipient melting of bonding surface


DEFINITION

Classification: 228/195

(under subclass 193) Process wherein the temperature of the parts is such that there is some slight melting and flowing at the points of highest pressure but wherein the melting point has not been reached and wherein the bonding is of the type relying on the intermix of the surface molecules of the faces.