US PATENT SUBCLASS 228 / 207
.~.~.~.~ Applying flux

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
203  DF  .~ With pretreating other than heating or cooling of work part of filler prior to bonding and any application of filler {4}
205  DF  .~.~ Cleaning {1}
206  DF  .~.~.~ Chemical {1}
207.~.~.~.~ Applying flux

DEFINITION

Classification: 228/207

(under subclass 206) Process wherein the cleaning includes the application to the meeting faces of material which assists in the bonding operation by protecting the parts during bonding or by being involved directly in the bonding operation.

SEE OR SEARCH THIS CLASS, SUBCLASS:

223, for the application of flux in a bonding operation wherein no change in the work parts or the filler is made prior to bonding.