US PATENT SUBCLASS 228 / 209
.~.~.~ Chemical deposition

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
203  DF  .~ With pretreating other than heating or cooling of work part of filler prior to bonding and any application of filler {4}
208  DF  .~.~ Applying preliminary bond facilitating metal coating {2}
209.~.~.~ Chemical deposition

DEFINITION

Classification: 228/209

(under subclass 208) Process wherein the coating is applied to the meeting face of the work part(s) by molecular transfer between the coating and the part.