US PATENT SUBCLASS 257 / 712
.~ With provision for cooling the housing or its contents


Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
712.~ With provision for cooling the housing or its contents {6}
713  DF  .~.~> For integrated circuit
714  DF  .~.~> Liquid coolant {2}
717  DF  .~.~> Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
718  DF  .~.~> Heat dissipating element held in place by clamping or spring means {1}
720  DF  .~.~> Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
721  DF  .~.~> With gas coolant {1}


DEFINITION

Classification: 257/712

With provision for cooling the housing or its contents:

(under subclass 678) Subject matter wherein means for cooling the housing or its contents are provided in addition to natural cooling processes.

SEE OR SEARCH CLASS

174, Electricity: Conductors and Insulators, appropriate

subclasses directed to cooling means.

361, Electricity: Electrical Systems and Devices,

688, 723, for cooling means for electronic devices or components with housings or mounting assemblies.