US PATENT SUBCLASS 264 / 272.17
.~.~.~.~.~ Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



264 /   HD   PLASTIC AND NONMETALLIC ARTICLE SHAPING OR TREATING: PROCESSES

239  DF  MECHANICAL SHAPING OR MOLDING TO FORM OR REFORM SHAPED ARTICLE {10}
241  DF  .~ To produce composite, plural part or multilayered article {9}
259  DF  .~.~ Shaping material and uniting to a preform {8}
271.1  DF  .~.~.~ Preform embedded in or surrounded by shaped material {6}
272.11  DF  .~.~.~.~ Electrical component encapsulating {9}
272.17.~.~.~.~.~ Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)


DEFINITION

Classification: 264/272.17

Semiconductor or barrier layer device (e.g., integrator circuit, transistor, etc.):

(under subclass 272.11) Processes in which the component exhibits asymmetrical voltage current conduction characteristics.

SEE OR SEARCH CLASS

438, Semiconductor Device Manufacturing: Process, particularly

112, 124, and 127 for methods of encapsulating semiconductor devices; see the search notes thereunder.