(under subclass 825) Process of manufacturing either: (1) an integrated circuit having electrical connecting structure in the form of an electrically conductive body having a generally rectangular cross section and wherein the body is mounted in a cantilever fashion to the circuit, or (2) an intermediate article of manufacture utilized to produce electrical connecting structure for integrated circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut, or otherwise deformed to produce an open encasing structure provided with a plurality of generally rectangular cross-sectioned inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
SEE OR SEARCH CLASS
216, Etching a Substrate: Processes,
14, lead frame or beam lead in an electrical circuit.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes),
666, 677 for electrical lead frames, per se, or combined with active solid-state devices.
361, Electricity: Electrical Systems and Devices, 813, for a lead frame supporting a plurality of diverse electrical components.
428, Stock Material or Miscellaneous Articles,
571, 574, if stock material is claimed either as an individual lead frame without being labeled "lead frame" or as a strip of interconnected lead frames prior to separation into individual lead frames.
111+, and 123 for methods of attaching a lead frame to a semiconductor device possessing significant semiconductor device structure; see the search notes thereunder.
