US PATENT SUBCLASS 423 / 350
.~.~.~ Utilizing reducing substance

Current as of: June, 1999
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423 /   HD   CHEMISTRY OF INORGANIC COMPOUNDS

324  DF  SILICON OR COMPOUND THEREOF {4}
348  DF  .~ Elemental silicon {1}
349  DF  .~.~ From silicon containing compound {1}
350.~.~.~ Utilizing reducing substance

DEFINITION

Classification: 423/350

(under subclass 349) Processes which include the use of a reducing element, compound or composition to release the silicon from the compound.

(1) Note. Heat is not a reducing "substance" for the purposes of this subclass. If only heat is used to reduce the silicon containing compound the patent is classified in subclass 349 above.