.~.~ With simultaneous sputter etching of substrate
DEFINITION
Classification: 427/524
With simultaneous sputter etching of substrate:
(under subclass 523) Processes wherein the sputter etching of the substrate is executed at the same time the coating is being applied to the substrate, which etching serves only to perfect the coating.
(1) Note. This class (427) is not proper for sputter etching, per se, which subject matter is classified in Class 204, however the combination of a 427 coating step combined with a 204 etching operation solely to perfect the coating is proper for this subclass.
(2) Note. In a Class 204 sputter etching process, the coating material is the target.
