US PATENT SUBCLASS 134 / 1.1
.~.~ Plasma cleaning


Current as of: June, 1999
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134 /   HD   CLEANING AND LIQUID CONTACT WITH SOLIDS

*  DD  PROCESSES {23}
1  DF  .~ Including application of electrical radiant or wave energy to work {2}
1.1.~.~ Plasma cleaning {1}
1.2  DF  .~.~.~> Semiconductor cleaning


DEFINITION

Classification: 134/1.1

Plasma cleaning:

(under subclass 1) Process which includes treating the work with a plasma.

(1) Note. Plasma for purposes of this subclass is a gas that is sufficiently ionized for its properties to depend on the ionization. It contains approximately equal numbers of positive ions and electrons so the mixture is electrically neutral, highly conductive and affected by magnetic fields. A thermal plasma is produced by temperatures above 20,000 degrees centigrade.

SEE OR SEARCH CLASS

216, Etching a Substrate: Processes, for etching processes involving the use of a plasma.