US PATENT SUBCLASS 361 / 714
.~.~.~.~ Through component housing


Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
688  DF  .~.~ With cooling means {2}
704  DF  .~.~.~ Thermal conduction {8}
714.~.~.~.~ Through component housing


DEFINITION

Classification: 361/714

Through component housing:

(under subclass 704) Subject matter wherein the heat conduction is through the housing which supports the electronic components.

SEE OR SEARCH THIS CLASS, SUBCLASS:

707+, for thermal conduction through component support means.