US PATENT SUBCLASS 438 / 406
.~.~ Bonding of plural semiconductive substrates


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

400  DF  FORMATION OF ELECTRICALLY ISOLATED LATERAL SEMICONDUCTIVE STRUCTURE {10}
404  DF  .~ Total dielectric isolation {7}
406.~.~ Bonding of plural semiconductive substrates


DEFINITION

Classification: 438/406

Bonding of plural semiconductive substrates:

(under subclass 404) Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.

SEE OR SEARCH THIS CLASS, SUBCLASS:

455, for a process of laminating or bonding of plural semiconductive substrates not resulting in an electrically isolated lateral semiconductor structure.