US PATENT SUBCLASS 438 / 463
.~ By electromagnetic irradiation (e.g., electron, laser, etc.)


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

460  DF  SEMICONDUCTOR SUBSTRATE DICING {5}
463.~ By electromagnetic irradiation (e.g., electron, laser, etc.)


DEFINITION

Classification: 438/463

By electromagnetic irradiation (e.g., electron, laser, etc.):

(under subclass 460) Process utilizing electromagnetic radiation for dividing the semiconductor substrate into plural distinct bodies.

(1) Note. Proper for this subclass are processes wherein the electromagnetic irradiation serves to from a "scribe" line (i.e., a weakened or removed area to facilitate subsequent separation) combined with an additional step of separating the substrate into distinct bodies at such line.