US PATENT SUBCLASS 438 / 613
.~.~.~ Bump electrode


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
612  DF  .~.~ Forming solder contact or bonding pad {1}
613.~.~.~ Bump electrode {2}
614  DF  .~.~.~.~> Plural conductive layers
615  DF  .~.~.~.~> Including fusion of conductor {2}


DEFINITION

Classification: 438/613

Bump electrode:

(under subclass 612) Processes wherein the electrical contact is in the shape of an abrupt protuberance elevated relative to the main surface of the substrate.