US PATENT SUBCLASS 438 / 618
.~.~ Contacting multiple semiconductive regions (i.e., interconnects)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
618.~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5}
619  DF  .~.~.~> Air bridge structure
620  DF  .~.~.~> Forming contacts of differing depths into semiconductor substrate
621  DF  .~.~.~> Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.)
622  DF  .~.~.~> Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) {8}
642  DF  .~.~.~> Diverse conductors {6}

DEFINITION

Classification: 438/618

Contacting multiple semiconductive regions (i.e., interconnects):

(under subclass 597) Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions