US PATENT SUBCLASS 438 / 117
.~ Incorporating resilient component (e.g., spring, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
117.~ Incorporating resilient component (e.g., spring, etc.)

DEFINITION

Classification: 438/117

Incorporating resilient component (e.g., spring, etc.):

(under subclass 106) Process for packaging a semiconductor substrate wherein the resulting structure includes an elastically compressible component.