US PATENT SUBCLASS 438 / 106
PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
107  DF  .~> Assembly of plural semiconductive substrates each possessing electrical device {2}
110  DF  .~> Making plural separate devices {2}
115  DF  .~> Including contaminant removal or mitigation
116  DF  .~> Having light transmissive window
117  DF  .~> Incorporating resilient component (e.g., spring, etc.)
118  DF  .~> Including adhesive bonding step {1}
120  DF  .~> With vibration step
121  DF  .~> Metallic housing or support {3}
125  DF  .~> Insulative housing or support {1}
127  DF  .~> Encapsulating

DEFINITION

Classification: 438/106

PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR:

(under the class definition) Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable

insulative material about a semiconductor substrate by dipping, etc.).

(1) Note. Packaging is a semiconductor art manufacturing term for integration, assembly, or surrounding of a semiconductor substrate (e.g., chip, die, etc.) with a permanent encasement, housing, capsule, or support. This is distinguished from package making found in Class 53 which is directed to preparing a manufactured product for passage through the channels of trade in a safe, convenient, and attractive condition, usually wrapped in a cover or in a container which is intended to be removed when the manufactured product is used.

(2) Note. See References to Other Classes in the class definition, for a listing of various related classes providing for unit or combined operations.

(3) Note. See References to Other Classes in the class definition, for a listing of various related classes providing for electrical connectors, electrical device housing or packaging, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

26, for a process of packaging (e.g., with mounting, encapsulating, etc.)or treating a packaged semiconductor device or circuit emissive of a nonelectrical signal.

51, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device responsive to physical stress. 55, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a thermally responsive semiconductor electrical device.

64, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a semiconductor device or circuit responsive to electromagnetic radiation.

100, for a process of manufacturing a point-contact-type semiconductor device.

616, for a process of transcribing bump electrodes which substantially do not retain their contour following transfer from a carrier substrate (e.g., template, etc.) to a semiconductor substrate.

SEE OR SEARCH CLASS

29, Metal Working, especially

827, for lead frame or beam lead device manufacture, subclasses 829+ for the assembly of an electrical component to an insulative base having a conductive path applied thereto, or formed thereon or therein (e.g., a printed

circuit board), subclasses 854+ for the assembly of an electrical component directly to terminal or elongated conductor, and subclasses 729+ for an electrical device manufacturing apparatus.

53, Package Making,

396+, for methods of encompassing, encasing, or completely surrounding goods or materials with a cover made from sheet material stock, and for methods of assembling or securing a separate closure (hood, cap, capsule, crown, seal, etc.) to the aperture of a preformed receptacle so as to complete the encasement of contents.

65, Glass Manufacturing, especially

36+, for a process of fusion bonding of glass to a formed part, and subclass 155 for electronic device making means involving fusion bonding. 148, Metal Treatment, for a process of treating metal to modify or maintain the internal physical structure (i.e., microstructure) or chemical properties of metal.

156, Adhesive Bonding and Miscellaneous Chemical Manufacture,

60+, for a single step process of adhesively bonding and for certain multistep processes having a step of adhesively bonding a nominal semiconductive chip or wafer.

216, Etching a Substrate: Processes, especially

13+, for processes of manufacturing a printed circuit board or thick film circuit board involving an etching step.

219, Electric Heating,

78.01+, for process and apparatus for bonding by electrical current and pressure.

228, Metal Fusion Bonding, appropriate subclasses, for a process of fusion bonding and additional operations which are considered to be ancillary to the bonding (preheating, positioning, pretinning, etc.) of a semiconductive substrate, especially

123.1, and 179.1+.

264, Plastic and Nonmetallic Article Shaping or Treating: Processes, for a process (and steps perfecting same) of shaping plastic or nonmetallic material and uniting it to a preform (e.g., encapsulating), said preform being a semiconductive substrate.

324, Electricity: Measuring and Testing, for a process of temporarily affixing a semiconductor substrate to a support

during the electrical testing thereof. 427, Coating Processes,

96+, for a process of coating an insulative substrate to form a printed circuit board or thick film circuit board.