US PATENT SUBCLASS 438 / 118
.~ Including adhesive bonding step


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
118.~ Including adhesive bonding step {1}
119  DF  .~.~> Electrically conductive adhesive


DEFINITION

Classification: 438/118

Including adhesive bonding step:

(under subclass 106) Process for packaging a semiconductor substrate including a step of joining the semiconductor substrate to a another body by nonmetallic bonding.

(1) Note. See Lines With Other Classes, "Packaging (E.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor" above. Also see the search notes below.

SEE OR SEARCH CLASS

156, Adhesive Bonding and Miscellaneous Chemical Manufacture,

60+, for a step of surface bonding or assembly therefor, and the Class 156 definition for special lines to Class 29, Metal Working.